Hyundai Motor Company:

In 2004, Hyundai Motors R&D Center worked with ISRI to design an education program for its automotive engineers who are increasingly working with software. Working collaboratively with Hyundai, ISRI created a plan for an 8-week, custom-tailored program in software engineering for embedded systems, for engineers from Hyundai companies including Hyundai Motors, Hyundai Mobis, Dymos, and Kefico. ISRI worked with Hyundai to understand the backgrounds of the engineers (automotive, mechanical, electrical, and computer), to tailor the program and maximize productive learning and interaction.

The education program was derived from Carnegie Mellon's existing programs in software engineering, autonomous mobile robots, and computer and electrical engineering, to teach principles, concepts, and applications of software-intensive embedded systems for the automotive industry.

The first half of the program was designed by faculty with substantial experience in the Master of Software Engineering program, as well as the Software Engineering Institute (SEI), and the automotive industry. The second half was designed by faculty with deep experience in embedded systems, covering the entire range, from software that controls printers and disk drives, to automobiles and other vehicles such as submarines and elevators.

ISRI worked with the faculty to develop the 8-week schedule, with lectures, reading and team assignments, and evaluations, and worked with Hyundai to formulate the plans for the final selection of participants, a preparation seminar held in Korea, departure and arrival plans, housing, the education program, wrap-up and return, and the final report to the company.

During the second half of the program, ISRI also arranged many meetings with faculty, for the engineers to discuss specific issues facing Hyundai and to consider future R&D collaboration. One company created an agreement with one of Carnegie Mellon's commercial spin-off companies, and together they developed innovative new technology that was submitted for a U.S. patent.